Who Holds the Riskiest Jobs in Wafer Fabrication?

A wafer fabrication plant (Fab) is an extremely complex environment with many hidden high-risk factors. Although it appears to be a clean, automated, high-tech workshop, it involves potential dangers such as high temperatures, high pressure, toxic gases, and highly corrosive chemicals.

I. Chemical Hazards

1. Highly Corrosive Chemicals
   Common substances:

• HF (Hydrofluoric acid): Extremely corrosive, can penetrate the skin and erode bones.
• H₂SO₄, HNO₃, KOH, NH₄OH, TMAH: Strong acids/alkalis, can cause burns upon skin contact.
• Usage areas: Post-cleaning of wet etch stations, developer stations, dry etch stations, etc.

2. Toxic Gases (Specialty Gases)
   Common substances:

• AsH₃ (Arsine), PH₃ (Phosphine), ClF₃, SiH₄: Highly toxic or flammable.
• Usage areas: CVD, diffusion furnaces, ion implantation.
• Risks:
  • Leaks can be fatal.
  • React violently with air or water (e.g., ClF₃).

3. Volatile Organic Compounds (VOCs)
   Sources: Photoresists (PR), thinners, organic cleaners.
   Hazards: Can cause chronic respiratory diseases and cancer.

II. Electrical and Mechanical Risks

1. High-Voltage Electric Shock
   Fab equipment typically operates at several hundred to thousands of volts.
   Common in: Etching equipment, power cabinets, ion implantation tools.
2. Plasma Burns
   Dry etching and ashing processes use high-power plasma.
   Contact or mishandling can cause burns and electric shock.
3. High-Speed Rotating Equipment
   Such as dicing machines and CMP (Chemical Mechanical Polishing) platforms.
   Risks: Cuts, entanglement injuries.
4. High-Pressure Gas Supply Systems
   Cylinder pressures can reach 2000 psi (approx. 14 MPa).
   Pipe leaks or cylinder explosions pose fatal risks.

III. Thermal Hazards

1. High-Temperature Equipment
   Diffusion and CVD furnaces can reach temperatures above 1000°C.
   Severe burn risks during maintenance of chambers or furnace tubes.
2. Thermochemical Reactors, e.g., Hot Acid Cleaning Machines
   Contact or splashing of liquids may cause deep burns.

IV. Physical Injuries: Electronic Radiation or Lasers

There may be other hazards—feel free to add more! But no need to worry too much—following proper procedures ensures minimal risk to individuals.

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