In recent days, a new batch of semiconductor projects in the industry has seen the latest progress, including Tianke Heda Jiangsu Xuzhou Silicon Carbide Wafer Phase II Project, Hangzhou Xinwei Semiconductor Project, Zhongshan Taiguang Electronics High-Performance Semiconductor Substrate Project, Zhejiang Dahe Semiconductor Industrial Park Phase III Construction Project, and more.
01
Suzhou Saicor Electronic Headquarters Building Commences Construction and Holds Groundbreaking Ceremony
On August 9th, Suzhou Saicor Electronic Technology Co., Ltd. officially began the construction and held a groundbreaking ceremony for its headquarters building.
According to a statement from Yangcheng Lake Peninsula, the groundbreaking ceremony for the Saicor Electronic headquarters building marks the company’s entry into an accelerated development phase. The project is expected to have a total investment of 200 million yuan and will be developed into the corporate headquarters of Saicor Electronic, integrating functions such as laboratories, research and development centers, marketing centers, and comprehensive management.
Saicor Electronic, established in 2009, is an integrated circuit design company that provides customers with lithium battery protection and power management solutions. Its products are widely used in consumer electronics such as smart wearable devices, portable heating equipment, and mobile power supplies. They have been applied in products of brands like Xiaomi and OPPO.
02
Expansion Project Commences: Skytech Heda’s Second Phase Silicon Carbide Wafer Expansion in Xuzhou, Jiangsu
On August 8th, the groundbreaking ceremony for the second phase expansion project of silicon carbide wafers, a subsidiary of Skytech Heda, Jiangsu Skytech Heda Semiconductor Co., Ltd. (referred to as “Jiangsu Skytech Heda”), was successfully held in Xuzhou Economic Development Zone.
The expansion project for the second phase of the Xuzhou Economic Development Zone by Jiangsu Skytech Heda plans to invest 830 million yuan, covering an area of 70 acres with a building area of approximately 50,000 square meters. It will acquire and install a total of 647 sets of equipment, including single crystal growth furnaces and supporting devices. The second phase project will add a production capacity of 160,000 wafers and is scheduled for completion in June of next year, with production starting in August of the same year. At that time, Jiangsu Skytech Heda’s total production capacity will reach 230,000 wafers.
Jiangsu Skytech Heda Semiconductor Co., Ltd. was established in October 2018, with its registered address in Xuzhou Economic and Technological Development Zone. It has a registered capital of 100 million yuan and nearly 500 employees. The company is a national-level high-tech enterprise and a Jiangsu provincial specialized, refined, and new small and medium-sized enterprise. It has established two municipal-level center platforms: Xuzhou Engineering Technology Research Center and Xuzhou Enterprise Technology Research Center.
03
Hangzhou Xinwei Semiconductor Project Settles in Ezhou Airport Economic Zone
On August 2nd, the signing ceremony for the Hangzhou Xinwei Semiconductor domestic photolithography machine production base project was held at the Industrial Exhibition Center of Ezhou Airport Economic Zone. The Ezhou Airport Economic Zone Management Committee and Hangzhou Xinwei Semiconductor Co., Ltd. signed the “Project Investment Contract.”
It is understood that Hangzhou Xinwei Semiconductor Co., Ltd. is China’s first fully integrated platform-level company with semiconductor photolithography technology. With self-owned advanced semiconductor photolithography technology as the core, the company expands and develops the three core processes of coating, developing, and inspection in the yellow-light process, providing customers with customized photolithography turnkey equipment platform services. The company holds 35 technical patents and has demonstrated outstanding performance in the three core processes of coating, developing, and inspection in the yellow-light process.
04
32 Billion Investment! Zhongshan Tai Guang Electronics High-Performance Semiconductor Substrate Project Signed
On August 4th, the signing ceremony for the capital increase and expansion project of Zhongshan Tai Guang Electronic Materials Co., Ltd. was held in the Zhongshan Torch Development Zone of Guangdong Province. The project focuses on the research, development, and manufacturing of high-performance semiconductor substrates, with a total investment of over 3.2 billion yuan. Once completed, it will become the most critical research, development, and manufacturing base for high-performance semiconductor substrates in the Greater Bay Area.
Public information shows that Zhongshan Tai Guang Electronic Materials Co., Ltd. is a high-tech enterprise engaged in the research, production, and sales of high-performance semiconductor substrates. Its products are mainly used in aerospace, 5G electronic communication equipment, new energy vehicles, AI artificial intelligence, and other fields.
05
Linghu Semiconductor New Materials Industrial Park’s First Project Signs and Takes Root
On August 8th, the first project of the Linghu Semiconductor New Materials Industrial Park, invested with 50 million yuan by Ningbo Industrial Group, officially signed a contract.
It is reported that the semiconductor material production base project of Ningbo MicroCore New Materials Technology Co., Ltd. has a total investment of 350 million yuan, covering an area of 35 acres. The project aims to establish a production base for electronic-grade photoresist materials (core materials such as photoresist resin and high-grade monomers) with an annual output of thousands of tons. It is estimated to achieve an annual output value of about 500 million yuan when fully operational.
06
Hongrun Semiconductor Headquarters Opens, Plans to Establish Memory Chip Packaging and Testing Headquarters Base
According to the official WeChat account of Changshu Economic Development Zone, on August 5th, Hongrun Semiconductor (Suzhou) Co., Ltd. held a headquarters opening ceremony.
It is understood that Hongrun Semiconductor’s headquarters is located in the Yangtze River Delta (Changshu) International Advanced Intelligent Manufacturing Industrial Park and plans to establish a headquarters base for memory chip packaging and testing. The core team members of the company have many years of experience in the industry and possess core competitive advantages in the development of integrated circuit testing software and hardware, research and development of integrated circuit testing equipment, and mass production testing of memory and SOC integrated circuits.
According to previous reports, the total investment in the Changshu project is 980 million yuan, with equipment investment reaching 800 million yuan. The annual output value is expected to be 650 million yuan after reaching full production, with an annual comprehensive tax revenue of over 50 million yuan.
07
Silicon Carbide Material Production Project Signs in Huai’an, Jiangsu
According to the announcement from Huai’an District, on August 3rd, Jiangsu Huai’an District held a signing ceremony for the silicon carbide material production project.
The silicon carbide material production project was introduced by the district committee’s organization department and invested in by Hong Kong Smartek Intelligence Co., Ltd. The project is located north of Guangzhou Road and east of Jing19 Road, covering an area of about 70 acres with a construction area of approximately 60,000 square meters. The project aims to establish production lines for the preparation, sintering, processing, purification, and cleaning of semiconductor silicon carbide powder and products.
The Chairman of Hong Kong Smartek Intelligence Co., Ltd. stated that this signing represents deep cooperation with the Huai’an District Government in the field of silicon carbide and is committed to promoting the high-quality development of the semiconductor industry.
08
Zhejiang Dahe Semiconductor Industrial Park Phase III Construction Project Completed
According to the announcement from Changshan, on August 3rd, the completion ceremony for the Zhejiang Dahe Semiconductor Industrial Park Phase III Construction Project was held, marking Changshan’s official status as a significant global manufacturing base for core components of semiconductor equipment.
The Zhejiang Dahe Semiconductor Industrial Park Phase III Construction Project was invested in and constructed by Zhejiang Dunyuan Juxin Semiconductor Technology Co., Ltd. and Zhejiang Fulede Semiconductor Material Technology Co., Ltd., with a total investment of nearly 2 billion yuan.
Zhejiang Dunyuan Juxin Semiconductor Technology Co., Ltd. will introduce a high-purity silicon component project, while Zhejiang Fulede Semiconductor Material Technology Co., Ltd. will introduce a production line for high-purity alumina and chemical vapor deposition silicon carbide products. Alumina products have excellent properties such as high-temperature resistance, oxidation resistance, corrosion resistance, wear resistance, high thermal conductivity, and high insulation. They are widely used in high-precision fields such as semiconductors, LED liquid crystal displays, lasers, and medical devices.
Once the project is fully operational, Zhejiang Dahe Semiconductor Industrial Park will become a significant global manufacturing base for core components of semiconductor equipment, with an annual output value of nearly 5 billion yuan. It will integrate the production, research and development, and sales of high-purity quartz components, precision semiconductor metal components, thermoelectric semiconductor cooling devices, high-purity silicon components, chemical vapor deposition silicon carbide, and precision semiconductor ceramic products.
09
Total Investment of 1 Billion: Hongfeng Semiconductor High-End Lead Frame Construction Project Signs and Settles in Haiyan
According to the announcement from Haiyan, on August 1st, the high-end lead frame construction project invested by Zhejiang Hongfeng Semiconductor New Materials Co., Ltd. was officially signed and settled in Haiyan Economic Development Zone (Xitangqiao Street).
The project’s investor, Zhejiang Hongfeng Semiconductor New Materials Co., Ltd., is a subsidiary of Wenzhou Hongfeng Electric Alloy Co., Ltd. Wenzhou Hongfeng Electric Alloy Co., Ltd. was founded in 1997 and is one of the domestic manufacturers of composite materials, components, and parts for electrical contact functions.
The new project has a total investment of 1 billion yuan and is planned to be located in Haiyan Economic Development Zone (Xitangqiao Street), on the west side of Haiou Road, the south side of Zhongle Road, and the east side of Yintan Road. The land covers a total of 86 acres and will be constructed in two phases. Once fully operational, the annual output value can reach 1.5 billion yuan. The project plans to introduce fully automatic reel-to-reel etching lines and reel-to-reel plating lines for lead frame production.
10
Integrated Circuit Special Process and Packaging Test Manufacturing Innovation Center Capability Building Project Passes Acceptance
According to the news from Huajin Semiconductor, the acceptance meeting for the Integrated Circuit Special Process and Packaging Test Manufacturing Innovation Center Capability Building Project was held at Huajin Semiconductor Packaging Technology Research and Development Center Co., Ltd. The successful acceptance of the project marks a significant achievement in the exploration of the Innovation Center in the field of integrated circuit packaging and testing.
This project focused on key generic technology research and development in special processes, packaging, and testing, especially in the area of three-dimensional high-density system integration. It established the basic framework and core team of the National Integrated Circuit Special Process and Packaging Test Innovation Center, aiming to create a comprehensive innovative research and development institution that encompasses high-density three-dimensional system integration, packaging design services, networked testing services, and intellectual property platforms. The project’s achievements have demonstrated breakthroughs in critical generic technologies for the industry, playing a demonstrative and leading role.
11
Total Investment of Nearly 7 Billion Yuan: Signing of 15 Projects Including Semiconductor Packaging Project
According to the “Outan Rongmei” public account, recently, the Ganzhou Economic and Technological Development Zone in Jiangxi Province held the signing ceremony for the seventh batch of investment promotion projects in 2023. A total of 15 projects were signed, with a total contract amount of 6.98 billion yuan, including:
- A semiconductor packaging project with a total investment of $150 million, mainly producing memory testing and packaging, chip design, and related semi-processed storage cards, USB drives, and SSD solid-state drives. After reaching full production and standards, the project is expected to achieve an import and export value of 1 billion RMB, including an export value of 500 million RMB.
- An electronic terminal equipment manufacturing project with a total investment of 600 million RMB, mainly producing mobile phones, tablets, laptops, etc. After reaching full production and standards, the project is expected to achieve an annual revenue of 600 million RMB and an annual tax payment of 10.8 million RMB.
- A new energy, photovoltaic energy storage magnetic components, and electronic components production project with a total investment of 600 million RMB, mainly producing magnetic components such as high-frequency transformers, power inductors, and EMC choke coils. These products are used in automotive electronics, new energy vehicle “three-electric” systems, photovoltaics, energy storage products, and electronic components. After reaching full production and standards, the project is expected to achieve an annual revenue of 600 million RMB and an annual tax payment of 10 million RMB.
12
Wuhan Minsheng – Salex Beijing 8-Inch BAW Filter Joint Production Line Mass Production Ceremony
According to the official WeChat account of Wuhan Minsheng, recently, Wuhan Minsheng New Technology Co., Ltd. (hereinafter referred to as “Wuhan Minsheng”) held strategic financing and Minsheng-Salex Beijing 8-inch BAW filter joint production line mass production ceremony in Beijing Yizhuang.
The news indicates that Wuhan Minsheng’s first batch of mass-produced BAW filters adopts a completely independent structural design and distinctive process technology route. Specific performance indicators have achieved significant breakthroughs, and product performance has reached an advanced level in the industry, marking the successful realization of Wuhan Minsheng’s independent research and development and production of high-end RF filters in China.
Meanwhile, Wuhan Minsheng announced the receipt of over 100 million yuan in strategic financing, with the current round of financing led by Saiwei Private Equity, and follow-up investments from Optics Valley Jinke, Yichang Siyuan Chan Investment, Shandong Chan Investment, etc.
In addition, at the order signing ceremony, Wuhan Minsheng signed relevant agreements with Saiwei Electronics, enabling strong collaboration and rapid integration of the industrial chain, and facilitating the rapid entry of products into the market.
13
Annual production of 10.8 million pieces! Sichuan Fulehua Power Semiconductor Ceramic Substrate Project Completion and Production
According to Deyama Thermal Magnetic News, recently, the completion and production ceremony of the Sichuan Fulehua Power Semiconductor Ceramic Substrate Project was held in the Jingkai District of Neijiang City.
Zhang Enrong, the general manager of both Jiangsu Fulehua and Sichuan Fulehua, introduced that the investment entity of the project is Jiangsu Fulehua Semiconductor Technology Co., Ltd. (hereinafter referred to as “Jiangsu Fulehua”). The total area of the project is 196 acres, with an initial investment of 1 billion yuan and a land area of 120 acres. The first phase of the project includes a newly built factory of about 80,000 square meters, establishing an automated and intelligent production line for the annual production of 10.8 million pieces of power semiconductor module ceramic substrate products. This will provide power semiconductor manufacturers worldwide with ceramic substrate products representing advanced technological levels in the industry, forming a large-scale power semiconductor ceramic substrate production base in inland China.
Information indicates that Jiangsu Fulehua was established in March 2018, controlled by Shanghai Shenhe Investment Co., Ltd., and is an advanced manufacturing company specializing in the research and development, manufacturing, and sales of power semiconductor copper-clad ceramic carrier boards (AMB, DCB, DPC, DBA), and carrier board production supply chain materials.
14
Fulede Semiconductor Industry Project Sensor Subproject Completed Signing
According to the official WeChat account of the Lishui Economic Development Zone, on August 2nd, the sensor subproject of the Fulede Semiconductor Industry Project was officially signed at the Shuijie Fund Industry Park.
It is reported that the total investment of the Fulede Semiconductor Industry Project is 12 billion yuan, mainly focusing on the construction of a 12-inch polished wafer production line, sensor projects, and more. After the first phase is completed, it will have an annual production capacity of 3.6 million pieces of 300mm semiconductor polished wafers. The products have characteristics such as replacing imported products, and the expected annual output value is 2.2 billion yuan. The construction of the 12-inch polished wafer production line project officially started in July.
The sensor subproject, which has been completed in this signing, has a total investment of 2 billion yuan, mainly focusing on the construction of a temperature sensor production line. The products will be applied in fields such as autonomous driving vehicles, industry, and medicine, with an estimated annual output value of 2 billion yuan after reaching production.
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