Unraveling SIP and SOP: Clearing Up Confusion

01

What is a System In Package (SIP)?

System in Package (SIP) is a new packaging technology in the field of IC packaging, and SIP is the highest level of packaging. The definition of SIP in ITRS2005 is: ‘SIP is a standard package that assembles multiple active electronic devices with optional passive components, as well as other devices such as MEMS or optical devices, using any combination to provide a variety of functions within a single package, forming a system or subsystem.’ For SIP, it is necessary to integrate different active chips and passive components, non-silicon devices, MEMS devices, and even optoelectronic chips within a single module. In the longer term, the consideration is to integrate biochips. Currently, especially in the field of wireless communication, particularly in the 3G field, SIP is a very promising technology.

02

SIP Advantages

SIP (System in Package) technology has made several significant breakthroughs and offers various distinct advantages, which can be summarized as follows:

1. Improved Packaging Efficiency: SIP technology stacks multiple chips within the same package, efficiently utilizing space in the Z-direction. This significantly reduces the package’s volume. The combination of two chips can increase the area by up to 170%, and three chips can increase it by up to 250%.
2. Shortened Time to Market: SIP eliminates the need for layout and wiring at the level of a SOC (System on a Chip), reducing the complexity of design, verification, and debugging. Even when local design adjustments are necessary, it is simpler and easier compared to SOC.
3. Compatibility of Different Technologies and Materials: SIP can integrate chips with different processes and materials to form a single system. For example, it can combine Si, GaAs, and InP chips into an integrated package, offering great compatibility and the potential for integrating passive components seamlessly.
4. Reduced System Costs: For specialized integrated circuit systems with relatively low demand, SIP technology can save more on system design and production costs compared to SOC.
5. Reduced Size and Weight, Improved Electrical Performance: SIP technology consolidates multiple packages into one, reducing the total number of solder joints, package size, weight, and length of component connections. This leads to enhanced electrical performance.
6. Comprehensive Interconnection and Functionality: SIP uses a single package to achieve a system’s desired interconnection, functionality, and performance parameters. It can employ wire bonding, flip-chip interconnects, and other techniques for direct interconnection with other IC chips.
7. Low Power Consumption and Low Noise: SIP offers low power and low noise system-level connectivity. It can achieve bus widths comparable to SOC, even at higher frequencies.
8. Mechanical and Chemical Resilience: SIP exhibits excellent resistance to mechanical and chemical corrosion, providing high reliability.
9. Efficient Use of Existing Chip Resources: SIP can add the functionality of existing chips to a system with minimal effort, enhancing design flexibility.
10. Versatility Across Different Fields: Unlike traditional chip packaging, SIP is applicable not only to digital systems but also to areas such as optical communication, sensors, and MEMS (Micro-Electro-Mechanical Systems).

These advantages make SIP technology a compelling choice for various applications and industries.

03

Distinguishing Between SOP and SIP

Currently, both domestically and internationally, many people use the English terms SOP (System on Package) and SIP (System in Package) interchangeably, believing that they represent the same concept and often use them together. However, SOP is already an acronym for “small out package,” which can lead to confusion. To avoid this confusion, many people prefer to use SIP.

Presently, in documents such as the ITRS (International Technology Roadmap for Semiconductor), JEITA (Japan Electronics and Information Technology Industries Association), and the JJTR (Japan Jisso Technology Roadmap, Japan Packaging Technology Roadmap), as well as in various international conferences, the abbreviation SIP is commonly adopted. This choice helps clarify the distinction between the two packaging concepts and ensures that “SIP” is understood as “System in Package.”

04

Comparison Between SIP and SOC

SOC (System on Chip) and SIP (System in Package) are two of the most prominent technologies in the electronics industry today. In the field of integrated circuits (IC), SOC represents the highest level of chip integration, while in the IC packaging field, SIP is the highest level of packaging. Both approaches aim to achieve system-level performance.

From a design perspective, the ideal scenario is to implement a system’s functionality on a single chip, which SOC can achieve with minimal cost, size, and optimal performance. However, SOC solutions have limitations when it comes to integrating non-silicon chips (such as GaAs and GeSi chips) and MEMS (Micro-Electro-Mechanical Systems). This is where SIP, as an alternative packaging approach, has gained increasing attention.

SIP and SOC are two parallel developments in system integration technology, driven by the trends in high performance, multifunctionality, miniaturization, lightweight design, and high reliability of electronic products. While they have similar objectives in integrating logic components, and digital, analog, and passive devices into a single unit, their development directions differ significantly.

SOC, a concept that emerged in the last decade or so, integrates multiple functions of a system into a single chip and then packages it into a system-level chip. Typically, it combines MPU (Microprocessor Unit), DSP (Digital Signal Processor), image processing, memory, RF (Radio Frequency), and logic circuits. SOC includes ASICs (Application-Specific Integrated Circuits) capable of meeting the demands of high-end computing, 3G communication, network servers, and more. Key SOC technologies include deep submicron processes, low voltage, low power, low noise design, isolation techniques, process-compatible special circuitry, design methodologies, embedded IP core design, testing strategies, co-design of software and hardware, and security and confidentiality measures. In practice, SOC faces challenges and constraints, including a lack of extensive IP core resources, barriers arising from economic and security considerations among companies, high development costs, long design cycles, complex manufacturing processes, and lower yields. Additionally, the use of mixed semiconductor technologies (such as GaAs and SiGe) in SOC presents issues.

SIP addresses some of the limitations of SOC. For instance, SIP boasts shorter design cycles, greater flexibility, lower R&D costs, reduced noise interference, and better process compatibility. However, it cannot entirely replace SOC, especially for applications with large production volumes and based on CMOS technology, where SOC remains the preferred choice.

SIP and SOC each have their strengths. SIP excels in high functionality, shorter development cycles, and cost-effectiveness, while SOC is known for its low power consumption, high performance, and small physical footprint. Both technologies complement each other, advancing together, and are capable of achieving system integration. Users can make the best choice based on their specific needs and circumstances.

05

Relationship Between HIC, MCM, and SIP

The development of integrated circuits (ICs) is a continuous process of improvement and innovation, building upon existing technologies. Three key technologies in this evolution are HIC (Hybrid Integrated Circuit), MCM (Multi-Chip Module), and SIP (System in Package). These three are not independent but rather represent a progression with each innovation building upon the foundation of the previous one.

To begin, the market scope of SIP is larger than that of conventional packaging, and it offers significant growth potential. The core of SIP involves the high-density assembly and interconnection of chips and components operating at different frequency ranges, mainly using HIC technology. Applying mature HIC technology to microwave and millimeter-wave frequency bands is an important direction for HIC’s development.

The distinction between SIP and MCM lies in their fundamental design and functionality. Multi-chip modules primarily involve connecting various chips and components, typically of the same kind, to add value. In contrast, SIP can accommodate different types of chips, allowing for signal access and exchange between these chips to achieve complete interconnection and meet the functional and performance requirements of a system-level target product.

In summary, the relationship between HIC, MCM, and SIP is one of evolutionary progression. HIC served as the foundation, with MCM refining the concept, and SIP taking it a step further by enabling the integration of diverse chip types, sophisticated interconnectivity, and the realization of a wide range of functional and performance parameters within a single package. These technologies build upon each other to meet the demands of an ever-advancing IC industry.

06

SIP’s Technological Objectives

Currently, SIP’s technological objectives revolve around achieving integration in two major mainstream development directions:

1. Integration of Micro-Electromagnetic Components and ICs: The primary goal is to achieve modularity, solid-state design, miniaturization, and high performance for various microwave and millimeter-wave circuits in conjunction with the entire system. This involves the integration of micro-electromagnetic components and integrated circuits.
2. High-Density Multi-Layer Interconnects with LSI and VLSI Chips: Building upon high-density multi-layer wiring boards, SIP aims to support the interconnection and assembly of electronic systems that are highly dense, compact, multifunctional, and highly reliable. This involves micro-structural electromagnetic interconnect assembly between various LSI and VLSI chips.

07

Future advancements in SIP technology will involve

• Utilizing Ultra-Fine Pitch Flip-Chip and Through-Silicon Via Interconnect (TWEI): This will establish a new level of interconnectivity. Ultra-narrow pitch flip-chip technology and through-silicon via interconnects will play a significant role in creating advanced interconnections.
• Incorporating Thin-Film Interconnect Technology: This will enable the integration of passive components within SIP, further enhancing its functionality.
• Leveraging High-Performance, High-Density Organic Functional Boards: This technology will facilitate three-dimensional chip stacking and package stacking. It enables the creation of advanced, highly compact structures.
• Collaborative Design and Testing Methods: SIP will encompass shared design and testing approaches for chips, packaging, and boards to ensure seamless integration and performance optimization.

Currently, an increasing number of international efforts are being dedicated to research and development in SIP. This includes the exploration of SIP design methodologies, new integration solutions, and technological advancements to meet the ever-evolving demands of the electronics industry.

Related:

1. Discover SIP Technology and Its Role in 16GB DDR4 Chips
2. Chip Packaging 101: A Beginner’s Comprehensive Guide
3. 2024: A Breakthrough Year for Advanced Packaging Tech?

Disclaimer:

1. This channel does not make any representations or warranties regarding the availability, accuracy, timeliness, effectiveness, or completeness of any information posted. It hereby disclaims any liability or consequences arising from the use of the information.
2. This channel is non-commercial and non-profit. The re-posted content does not signify endorsement of its views or responsibility for its authenticity. It does not intend to constitute any other guidance. This channel is not liable for any inaccuracies or errors in the re-posted or published information, directly or indirectly.
3. Some data, materials, text, images, etc., used in this channel are sourced from the internet, and all reposts are duly credited to their sources. If you discover any work that infringes on your intellectual property rights or personal legal interests, please contact us, and we will promptly modify or remove it.