The chip development process is a complex and multi-stage procedure that encompasses all stages from the initial concept of the chip to its final market launch. Below is the main process of chip development:
01
Chip Planning Stage
Before any research and development work begins, the chip planning phase is essential. This stage determines the target market, functional requirements, competitive analysis, and other factors. Just like a company conducting market research, user demand analysis, and competitor analysis before launching a new product, chip planning serves as the foundation to assess the market potential and product positioning of the chip.
02
Architecture Design and IP Selection
Chip architecture design is the first step in the entire chip design process. In this phase, chip architects determine the overall structure of the chip, deciding which hardware resources and technical routes to use. Architecture design is akin to a blueprint for a house, defining the chip’s functionality and performance. Additionally, suitable IP (Intellectual Property cores) need to be selected, which are pre-designed, reusable circuit modules, similar to parts in a model kit. The choice of IP will influence the subsequent design work, as it determines whether some functions of the chip can use existing technology or need to be newly designed.
03
Pre-research (Preliminary Research)
For chips with high technical demands or significant innovation, a pre-research phase is necessary. During this phase, the R&D team explores various solutions, algorithms, and optimization methods to determine the feasibility and best implementation of the final design. This phase is similar to an architect’s preliminary research and investigation before formal design, assessing the effectiveness of different materials and design solutions.
04
Design and Verification
Based on the preliminary design, digital circuit design engineers and digital verification engineers begin the main R&D phase. Design engineers are responsible for completing the chip’s circuit design, usually using hardware description languages like Verilog or VHDL. This process is similar to a programmer writing software code to describe the functionality and logic of internal circuits.
Verification engineers are responsible for checking the correctness of the design, ensuring that each module performs as expected in practice. Verification involves not only checking the functionality of individual circuit modules but also ensuring that the collaboration between modules works smoothly. Additionally, mixed-signal verification is needed to ensure the integration of digital and analog circuits.
05
Synthesis and Place and Route (PR)
Once all circuit designs and verification are completed, the chip enters the synthesis phase. The task of synthesis is to convert high-level descriptions such as Verilog or VHDL into actual gate circuits, which are known as standard cells. However, at this stage, the circuits are merely “logical circuits,” lacking component placement and connection information.
Next, the chip enters the place and route phase. During this stage, designers allocate specific locations for each component and draw circuit connections between them. Placement can be understood as determining the exact position of each building structure, while routing connects these structures through roads. After completing the place and route, the chip design takes on a physical form.
06
Post-simulation Verification and Design Checks
After the place and route phase, designers must perform a series of verifications and checks to ensure that the design can be successfully manufactured and meets performance requirements. These verifications include:
- Post-simulation Verification: Simulating the design after place and route to ensure the circuit’s functionality and timing meet expectations.
- Static Timing Analysis (STA): Checking the chip’s timing to ensure that all signal transmission requirements are met and that no errors occur during high-speed operation.
- Design Rule Check (DRC): Verifying that the layout conforms to the manufacturing process design rules to avoid issues during production.
- Layout vs. Schematic (LVS): Ensuring that the layout matches the schematic to avoid design errors.
These checks are similar to quality inspections before construction, ensuring the building is safe and up to standard before use.
07
Tape-out and Manufacturing
After all design and verification steps are completed, the chip enters the tape-out phase. Tape-out refers to the process of transferring the chip design into a physical wafer, where the chip’s circuit pattern is etched onto the wafer. This process is similar to producing actual items through sculpting or casting. A single wafer can be etched into multiple dies, with each die representing a chip’s circuit core.
08
Packaging and Testing
The manufactured dies must be packaged, which involves placing the chip inside a protective casing and connecting the chip’s circuits to the outside through metal leads for external circuit connections. The packaged chip still needs to undergo performance testing to ensure its functionality. This is like a manufactured car going through quality control to ensure it is safe to drive.
09
Mass Production and Market Launch
Once the chip has passed all functional and performance tests, it enters the mass production stage. At this point, the chip is ready for market launch. As mass production progresses, the chip can be produced in large quantities and distributed to the market.
10
Software Support and Optimization
The role of software engineers spans the entire chip development lifecycle. Whether during design validation or in the later market application phase, software plays a crucial role. Especially in the later stages of chip development, software engineers need to provide drivers for the chip to ensure its integration with actual business operations and assist in fixing any potential hardware defects.
11
Conclusion
The chip development process involves multiple stages, from chip planning, architecture design, module development, to final packaging and testing. Each step is interlinked and requires close collaboration among engineers from various disciplines. Design, verification, manufacturing, packaging, and testing are all critical steps to ensure the chip’s success in the market.
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