Application

YUNZE offers storage solutions for many applications throughout many industries — and Industry 4.0 can also count on our experience for their special industrial applications. You can find YUNZE embedded solutions in many of the most famous devices that define our digital era. Customers appreciate the “win-win” philosophy that drives our solutions business.

Package Type

Yunze offers many types of IC packaging, including BGA, SIP, LAG, QFN, TSOP and more.

Integrated circuit packaging is the final stage of semiconductor device fabrication: the block of semiconductor material is encapsulated in a supporting case to prevent physical damage and corrosion. The case, the “package”, must support electrical contacts to connect the IC to a circuit board.

In the integrated circuit industry, the process is often referred to as packaging. Other names include semiconductor device assembly, assembly, encapsulation or sealing.

Any word you use to describe the process, it’s hard work so not every flash storage brand does packaging. Yunze experts have more than 10-years of experience in packaging and in projects covering custom or off-the-shelf solutions from dozens of industries.

The packaging stage is always followed by testing of the integrated circuit: also an important service that Yunze excels in, especially on custom projects.

Design considerations

  • Electrical — the structure and materials must prioritize signal transmission properties.

 

  • Mechanical, thermal — packaging needs to be strong, resist moisture, dissipate heat, and shield against EM interference.

 

  • Economic — the smaller, more complex the package, the more expensive it usually is to make.

BGA

Requiring advanced packaging technology, Ball Grid Array (BGA) involves a sphere-shapes solder ball lined up in array shape as terminal at the package bottom. Wire bonding and the flip-chip joins between Multiple core and interposer, sealed with resin. A BGA can provide more interconnection pins as well as high density of pins.

SiP

SiP (System in Package) integrates multiple functional chips (including processors, memory and other functional chips) into one package. SiP packaging lets us integrate multiple IC, packaging and testing technologies to create highly integrated products with optimal cost, scale and performance.

Yunze Technical features
YUNZE Technical Features (1)

Technical Features

Elevating your performance to new heights amid the most demanding scenarios is a hallmark of Yunze’s approach. Our meticulous process involves an intricate sorting of particles, spanning an impressive temperature spectrum from -40 to 85℃, prior to the application of final patches. This meticulous attention ensures an unrivaled uniformity in our offerings, setting the standard for consistency. Each meticulously crafted piece is subjected to a comprehensive sorting procedure across this expansive temperature range, a testament to its unyielding prowess in thriving even in the most extreme conditions. Trust in Yunze for products engineered to withstand temperature extremities, guaranteeing reliability that remains uncompromised.

When it comes to safeguarding your most sensitive data and optimizing performance, hardware AES encryption emerges as the clear frontrunner. In comparison to software-based encryption, the utilization of hardware AES encryption offers superior data protection and operational efficiency. Particularly in applications handling critical and confidential information, or those prioritizing data security enhancements, hardware AES encryption stands as the unwavering choice. Elevate your data protection strategy with the robust capabilities of hardware-based AES encryption, ensuring not only fortified security but also streamlined operations for optimal results.

Elevate your SSD module’s safeguarding to unparalleled levels with the ingenious tri-proof paint coating scheme. This exceptional choice guarantees not only the utmost protection for your device’s components but also reinforces its overall durability. By incorporating a meticulous conformal coating process, our solution goes the extra mile in ensuring product reliability. This strategic approach involves applying a protective layer to the printed circuit boards, effectively bestowing the device with waterproof, dustproof, and moisture-resistant capabilities. When seeking optimal security and performance for your SSD module, embrace the tri-proof paint coating scheme – a definitive investment in safeguarding and longevity.

Unleash the potential of your module with the revolutionary Anti-Vulcanization technology, a game-changer in safeguarding the critical components. This ingenious innovation targets the sulfuration of parts that are susceptible to functional disruption, ensuring seamless module operation. Tailored for environments characterized by elevated temperatures, high humidity, and heightened pollution, as well as those rich in sulfur gas concentration, our Anti-Vulcanization technology is the ultimate solution. Elevate your module’s reliability and performance in the face of challenging conditions, unlocking a world of uninterrupted efficiency and longevity. Embrace cutting-edge technology that guarantees peak functionality – choose Anti-Vulcanization for a future-proof module experience.

Experience unshakable reliability with our cutting-edge approach – two to three firmware versions meticulously safeguarded across diverse Flash locations. When a firmware version faces unforeseen damage, our intelligent system seamlessly steps in. Through automatic detection and swift initiation of a backup firmware, we elevate the stability and security of your hard disk drive to unprecedented heights. Say goodbye to disruptions and vulnerabilities, and embrace a future where your data remains safeguarded and your system remains resilient. Elevate your confidence in hard disk drive performance with our advanced backup solution – a game-changer for seamless functionality and unwavering peace of mind.

Unveil the mastery of SSD junk data recovery mechanism – a transformative innovation that orchestrates and fine-tunes dispersed Flash space during periods of non-write or read activity. This revolutionary approach harnesses an additional blank block, strategically positioned as a buffer, to amplify its impact on SSD durability and performance. By seamlessly optimizing space and capitalizing on strategic buffering, our mechanism redefines the landscape of SSD functionality. Witness the future of storage solutions where every spare resource is leveraged for your advantage, elevating both the longevity and efficiency of your SSD. Embrace a new era of peak SSD performance – powered by our unrivaled junk data recovery mechanism.

Elevate your data security to an unprecedented level with Yunze’s cutting-edge solution tailored for confidential application environments. In scenarios demanding complete and irrevocable data destruction, our physical destruction technology steps in with precision and power. Using a potent combination of high voltage and robust current, it meticulously dismantles each Flash controller, leaving no room for compromise. Say goodbye to uncertainties and vulnerabilities, and embrace the pinnacle of data protection. When confidentiality is paramount, trust in Yunze to deliver a solution that guarantees peace of mind and total obliteration of sensitive information. Unleash the force of physical destruction technology and safeguard your data with the utmost certainty.

Experience a breakthrough in performance and durability with the innovative application of MLC flash architecture. Unleashing its capabilities to emulate the renowned performance and resilience of industrial SLC flash memory, we introduce pSLC – the ultimate alternative solution primed for mission-critical embedded and industrial applications. This pioneering approach redefines the landscape, presenting a reliable and cost-effective avenue to elevate your projects to new heights. Embrace the power of MLC flash architecture harnessed to simulate SLC excellence, paving the way for unmatched performance and dependability in the most demanding scenarios. Rely on pSLC to transform your mission-critical endeavors into resounding successes, where innovation and reliability converge seamlessly.

Step into the future of temperature management with Yunze’s cutting-edge thermal sensor technology, seamlessly integrated with S.M.A.R.T. monitoring. This dynamic duo is meticulously engineered to track and respond to temperature fluctuations within your storage products. By coupling this advanced thermal sensing prowess with intelligent temperature control technology, a harmonious symphony is created. As temperature shifts occur, the host system is promptly alerted, initiating a sophisticated protection mechanism that ensures the preservation of your valuable data. Rely on Yunze to usher in a new era of proactive temperature management, where innovative synergy guarantees optimal performance and unwavering protection for your storage solutions. Embrace the power of foresight with Yunze’s thermal sensor technology, a game-changer in safeguarding your critical data assets.

Introducing a revolution in resilience – Yunze’s pioneering IC bottom filling technology. Crafted to excel in the face of high-intensity vibrations, this cutting-edge solution sets a new standard for reliability. Particularly in the midst of heightened pressures and relentless vibrations, our innovation stands as an unwavering fortress for your systems. Brace yourself for a future where durability meets ingenuity, as Yunze’s IC bottom filling technology propels your systems to unmatched robustness and dependability. In the harshest environments, trust in our innovation to redefine what’s possible and ensure your operations remain unshaken. Elevate your systems to the zenith of performance and security – choose Yunze for a future sculpted by groundbreaking technology.

Elevate the lifespan and reliability of your Flash device with a transformative solution – global wear leveling technology. With the strategic aim of achieving uniform data distribution across each block, this innovation guarantees not only optimal performance but also safeguards against potential harm or data loss due to frequent wear leveling. By intelligently managing data allocation, the technology ensures that no single block is overburdened, leading to enhanced durability and rock-solid stability for your Flash products. Trust in global wear leveling to revolutionize your data storage experience, providing unparalleled longevity and preserving your critical information with unwavering assurance. Embrace a future where every byte is optimized and protected – choose global wear leveling technology for a true paradigm shift in Flash product resilience.

Empower your data security with the formidable shield of write-protection – an impenetrable barrier against unauthorized data alterations. Whether enforced through robust hardware switches/pins or client software commands, this cutting-edge technology stands guard, ensuring that no unwanted modifications find their way into your hard disk. Embrace a future where your critical information remains inviolable, untouched by external threats. Trust in write-protection to redefine the boundaries of data integrity, creating an impervious sanctuary for your invaluable digital assets. Choose the assurance of write-protection for a realm of unyielding protection, where unauthorized access is unequivocally thwarted, and your peace of mind is paramount.