Samsung is the world’s largest memory chip manufacturer, and for a long time, it has had a leading technological edge in both DRAM and NAND flash memory chips. However, in recent years, Samsung’s semiconductor business has encountered numerous challenges, particularly in advanced process manufacturing, where it has been gradually outpaced by TSMC. This has not only delayed the development of its own logic chips but has also begun to affect its memory business.
According to TrendForce, Samsung will hold a Galaxy Unpacked event in late January to launch the new generation Galaxy S25 series smartphones. However, surprisingly, the new models will use Micron’s mobile DRAM chips instead of Samsung’s own mobile DRAM chips, which is a severe blow to Samsung’s memory business.
As early as last September, it was reported that Samsung Electronics’ MX division had expressed concerns to the DS division about delays in the delivery of 1β (b) nm (fifth-generation 10nm-class) LPDDR samples for the Galaxy S25 series. These samples, which included 12Gb and 16Gb capacities, could not meet the necessary quantity requirements due to poor yield rates. After a series of evaluations regarding performance, pricing, and supply, the MX division ultimately chose the competitor’s LPDDR5X chips.
Currently, Samsung is lagging behind SK Hynix in the HBM field, with its HBM3E products still struggling to pass Nvidia’s validation. With the Galaxy S25 series opting for Micron’s LPDDR5X chips, it signifies that Samsung acknowledges its competitor’s products are superior. Samsung now urgently needs to make changes to reverse the trend in its DRAM technology.
Source: TrendForce
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