Qualcomm recently announced the release of its new low-power Wi-Fi chip, QCC730. The chip promises improved coverage and data transmission rates, consumes less power and offers direct cloud connectivity.
Designed for IoT devices, this dual-band low-power Wi-Fi chip reportedly reduces power consumption by 88% per data transmission compared to its predecessor. The QCC730 chip features direct cloud connectivity, integration with the open-source standard Matter, an open-source SDK and IDE, and the ability to offload cloud connectivity through the software stack. Seen as a Bluetooth alternative for IoT applications, it can operate in both hosted and hostless modes.
Note: Matter is an open-source standard that unifies various home ecosystem products. Any smart home device compatible with the Matter protocol can be configured on platforms that support Matter. Companies such as Apple, Samsung, Midea, Green Rice, OPPO, and Ubuntu currently support the Matter standard.
In addition to the QCC730, Qualcomm also launched the RB3 Gen 2 robotics platform. This mid-range product in Qualcomm’s robotics platform line-up includes the Qualcomm QCS6490 CPU (octa-core, Turbo frequency 2.7GHz), Adreno 643 GPU, support for multiple camera sensors, an integrated Wi-Fi 6E chip, and support for Bluetooth 5.2 and LE audio. It is designed for enterprise and industrial solutions.
Qualcomm plans to promote the RB3 Gen 2 platform across a wider range of products, including drones, cameras, and other industrial devices. The development kit includes a power supply, speaker, USB cable, and a development board. A vision kit with a mounting bracket and Camera Serial Interface (CSI) is also available from Qualcomm.
The Qualcomm RB3 Gen 2 is expected to be available in June.
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