On January 8, Micron, one of the three major manufacturers of HBM memory, announced that its advanced packaging factory project for HBM memory in Singapore broke ground today, local time, and is scheduled to begin operations in 2026. This will be the first such factory in Singapore.
The factory will significantly increase Micron’s total advanced packaging capacity starting in 2027 to meet the growing demand for HBM memory in the AI chip industry.
Micron’s President and CEO, Sanjay Mehrotra, stated:
“As AI continues to spread across industries, the demand for advanced memory and storage solutions will continue to grow rapidly. With the ongoing support of the Singapore government, our investment in the HBM advanced packaging factory strengthens our position to capitalize on the expanding AI opportunities in the future.”
Heng Swee Keat, Chairman of the Singapore Economic Development Board, who attended the event, said:
“We welcome Micron’s significant investment, which reflects its confidence in Singapore’s competitiveness as a key node in the global semiconductor supply chain.”
This is Singapore’s first HBM advanced packaging facility, enabling us to contribute to global AI growth. It expands Singapore’s partnership with Micron and further strengthens Singapore’s semiconductor ecosystem.
Micron stated that its long-term investment in HBM advanced packaging in Singapore will amount to $7 billion, initially providing 1,400 jobs, with plans to expand to 3,000 positions in the future. The company’s expansion plans in Singapore will also support the long-term manufacturing needs of NAND flash memory.
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