JEDEC New DDR5 Standard Hits 8800Mbps Speeds!

A new DDR5 standard has arrived, keeping pace with high-performance computing memory.

In 2020, the JEDEC Solid State Technology Association first announced the DDR5 SDRAM standard, with a focus on increasing memory density and frequency. The maximum speed reached 6400 Mbps, with a single LRDIMM having a maximum capacity of 2TB, and a maximum UDIMM capacity of 128GB.

Recently, the JEDEC Solid State Technology Association announced the release of the latest JESD79-5C DDR5 SDRAM standard, aimed at improving reliability and security and further enhancing performance, suitable for various applications ranging from high-performance servers to emerging technologies such as artificial intelligence (AI) and machine learning (ML). According to the association, the new standard’s documentation is now available for download from the official website.

In the JESD79-5C DDR5 SDRAM standard, the JEDEC Solid State Technology Association introduced an innovative solution to improve DRAM data integrity, called PRAC, which will precisely calculate DRAM activation times based on row granularity. When PRAC-enabled DRAM detects excessive activation times, it will alert the system to pause traffic and specify a time to take mitigating measures. This closely coordinated approach between DRAM and the system provides a fundamentally accurate and predictable method for addressing data integrity challenges.

The main features of the JESD79-5C DDR5 SDRAM standard include:

  • Expanding the standard timing parameters from 6800 Mbps to 8800 Mbps.
  • Extending DRAM core timing and Tx / Rx AC timing to 8800 Mbps, whereas previous versions only supported up to 6400 Mbps timing parameters and segments of up to 7200 Mbps core timing.
  • Introducing Self-Refresh Exit Clock Sync to optimize I/O training.
  • Incorporating Dual-Die Package (DDP) timing.
  • Discontinuing Partial Array Self-Refresh (PASR) to address security issues.

Mian Quddus, Chairman of the JEDEC Board of Directors, expressed his pleasure with the efforts of the JC-42 committee in advancing the DDR5 SDRAM standard, noting that the breakthrough features of JESD79-5C are designed to support the industry’s evolving needs for security, reliability, and performance in various applications.

DDR5 is rapidly expanding its market share.

As AI large models continuously evolve and upgrade, increasing their parameters, the computational burden grows, and AI servers, which are the core of computing power and host GPUs, FPGAs, ASICs, and other high-performance chips, are vital. In 2023, nearly 1.2 million AI servers were shipped, an increase of 38.4% year-over-year, accounting for 9% of the total server shipments. This trend is expected to continue, reaching a 15% market share by 2026.

Support for larger model parameters requires high-capacity, high-speed memory. Micron, at a legal conference, stated that an AI server uses 6-8 times more DRAM than a standard server. By 2026, the server DRAM market (excluding HBM) is expected to reach $32.1 billion.

The demand for more powerful memory—DDR5—is increasing due to its higher speed, larger capacity, and lower energy consumption compared to DDR4. DDR5 memory’s maximum transfer rate reaches 6.4Gbps, double that of DDR4.

Memory interface chips are the core logic devices in server memory modules, serving as essential pathways for server CPUs to access memory data, enhancing the speed and stability of memory data access, and meeting the growing high-performance and large-capacity needs of server CPUs.

As DDR memory technology evolves to DDR5, the usage of memory interface chips is also increasing. Following the launch of Intel and AMD’s new platforms supporting DDR5, the server DDR5 market faced PMIC compatibility issues, hindering rapid market expansion and new platform launches. Currently, DRAM manufacturers and PMIC vendors are addressing these issues. Although the short-term supply of original DDR5 is constrained, the abundance of PMIC suppliers allows for switching and adaptation, which should not become a bottleneck for increasing DDR5 penetration rates. Server DDR5 penetration rates are expected to reach about 30% this year. With the accelerated development of AI servers and the gradual resolution of PMIC yield issues, DDR5 penetration rates are expected to further increase, reaching 85% by 2026.

Lee Jung-bae, Executive Vice President and Head of Memory Business in the U.S. for Samsung Electronics, stated in a blog post that the company will expand its production capacity for 32GB DDR5 and 1TB modules. He mentioned, “We will actively utilize new interfaces such as CXL memory modules (CMM), which will help achieve seamless scalability of memory bandwidth and capacity according to operational needs.”

SK Hynix also stated that it plans to increase investment in high-bandwidth memory and DDR5 chips to meet the growing demand in the AI market. “Compared to 2023, capital expenditures will increase in 2024. … We have adjusted capital expenditures within the range of investment amounts in 2023 based on product priorities. In 2024, we will focus more on transitioning process technologies rather than just increasing capacity,” said Kim Yoo-hyun, Vice President and Chief Financial Officer at SK Hynix. He mentioned that SK Hynix aims to increase the proportion of fourth and fifth-generation 10nm-level memory chips to more than half of the company’s DRAM production by the end of 2024. However, he noted that reaching the production capacity level of the fourth quarter of 2022 will take considerable time.

According to TrendForce, in the second half of 2023, SK Hynix overtook Samsung Electronics to become the world’s largest server DRAM manufacturer. The report showed that in the third quarter of 2023, SK Hynix’s server DRAM sales reached $1.85 billion, capturing 49.6% of the market share and securing the global leadership position, while Samsung Electronics, in the same quarter, had server DRAM sales of $1.313 billion, holding a 35.2% market share. Micron, with server DRAM sales of $560 million, held a 15% market share, ranking third.

The above statistics are only for traditional servers equipped with DDR5 memory, not including HBM used in AI servers.

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