Yesterday, chip giant Intel announced that it had taken the lead in assembling ASML’s high-NA (high numerical aperture) EUV (extreme ultraviolet) lithography machine, stating that this marks a significant step in surpassing its competitors.
In December last year, ASML confirmed the delivery of the first high-NA EUV lithography system to Intel, with the machine priced at 350 million euros (approximately 2.7 billion yuan).
Intel’s lithography director, Mark Philips, stated, “We recognized the price of these devices when we decided to purchase them. If we didn’t think they were worth the money, we simply wouldn’t have bought them.”
Previously, Intel CEO Pat Gelsinger had indicated that the device would be used for challenges below 1.8nm.
In addition to Intel, TSMC, Samsung, SK Hynix, and Micron have also ordered this machine, but due to the potential six-month duration required for transportation and installation, Intel’s initiative has given it at least a six-month lead over its competitors.
Intel’s decision to be the first to adopt the high-NA EUV lithography machine was not coincidental.
Although Intel was involved in the development of EUV lithography technology, it was later than its competitor TSMC in starting to use ASML’s first EUV lithography machine, a mistake that Gelsinger admitted was serious.
Philips also stated, “Now that we have the long-awaited next generation of EUV lithography machines, we do not want to repeat past mistakes.”
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