On September 26th, Samsung Electronics announced that it has developed its first 7.5Gbps (gigabytes per second) low-power compressed additional memory module (LPCAMM) specification, and this research achievement has been system-verified on the Intel platform.
Samsung is gearing up to put LPCAMM to the test with major players, including Intel, later this year, setting the stage for its commercial debut in 2024.
Currently, personal computers and laptops rely on conventional LPDDR DRAM or DDR-based So-DIMMs (Small Outline Dual In-Line Memory Modules). However, LPDDR, due to its structural constraints, necessitates soldering directly onto the device’s motherboard, posing challenges for maintenance or upgrades. On the flip side, while So-DIMMs offer more convenient installation and removal options, they bring along several limitations in terms of performance, power consumption, and physical characteristics.
With the continuous evolution of technology, LPCAMM is poised to conquer the limitations of both LPDDR and So-DIMMs mentioned earlier. LPCAMM takes the form of a removable module, providing manufacturers of personal computers and laptops with greater flexibility. In comparison to So-DIMMs, LPCAMM’s size can be reduced by a staggering 60%, efficiently utilizing the device’s internal space, resulting in a remarkable 50% boost in performance and an impressive 70% enhancement in efficiency. While LPDDR has earned its stripes for power-saving attributes in server applications, it grapples with certain practical limitations, such as necessitating the replacement of the entire motherboard when upgrading server DRAM specifications—a predicament LPCAMM expertly sidesteps.
Samsung envisions that LPCAMM will permeate the realms of personal computers, laptops, and data centers, potentially reshaping the DRAM landscape for personal computing and laptops, and even influencing the data center DRAM market.
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