In March, Infineon’s Consumer, Computing & Communications business team unveiled 300mm GaN power semiconductor wafers and Infineon’s 20μm ultra-thin silicon power wafers in Shenzhen, marking the launch of the “Infineon Consumer, Computing & Communications Innovation Conference 2025” (ICIC 2025) held in the city, showcasing the company’s latest technological innovations.
At the event, Infineon invited industry guests to discuss trending topics such as AI, robotics, third-generation semiconductor applications, and edge computing. The company also shared its latest solutions, product strategies, and business expansion priorities. AI and robotics, as the hottest topics of the moment, became the main focus of ICIC 2025. Infineon’s Senior Vice President and President of Greater China, David Poon, along with other team members, highlighted Infineon’s strategic layout in these two key areas.
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Left Hand: AI – From Power Supply to Full-Stack Enablement
AI is undoubtedly one of the most talked-about areas in technology today. As a long-established semiconductor leader, Infineon’s approach is more “comprehensive and multi-layered.” Based on the presentations, Infineon has adopted a full-stack strategy, ranging from AI data center infrastructure to end applications like intelligent robotics and edge computing.
✅ Power AI: Efficient Power Supply for AI
With the exponential increase in AI model parameters, the power consumption of a single GPU has surged from 400W to 2000W, and a full server rack can now consume up to 150kW—with projections that this may soon exceed 800kW or even 1MW. This unprecedented demand places huge challenges on power management systems.
“The surge in computing power driven by the AI wave comes with an electricity demand challenge. Research indicates that the electricity load of China’s data centers is expected to double by 2030 and may account for over 10% of national consumption by 2035,” said David Poon.
Infineon showcased its powerful power management solutions for AI servers and data centers.
Poon noted, “High efficiency is the result of Infineon’s years of experience in server power supply. We work closely with GPU and CPU manufacturers and use different combinations of silicon, SiC, or GaN in power units of varying capacities to achieve optimal efficiency.”
Infineon’s power solutions reportedly increase efficiency by 8–10% on average, and power density by 30–60%, which is crucial for improving data center performance and stability.
Notably, Infineon showcased its 300mm GaN power semiconductor wafer technology in China for the first time. Compared to traditional 8-inch wafers, 12-inch GaN wafers yield more chips per unit area, improving productivity and significantly reducing unit costs. Liu Wei, Vice President of Infineon Technologies and Head of Marketing for the Consumer, Computing & Communications business in Greater China, said: “Our 12-inch GaN wafer technology marks a major breakthrough in power semiconductors and will help meet the high-performance power demands of AI data centers.”
✅ Enable AI: Bringing AI to the Edge
Beyond powering large AI infrastructures, Infineon is also actively pushing AI toward the edge. Through products such as its AURIX and PSoC Edge microcontrollers, Infineon supports edge AI applications with high efficiency and reliability. This “cloud-edge collaboration” strategy enables Infineon to cover the full AI ecosystem from data centers to end devices.
In the edge AI space, Infineon emphasized the importance of its sensor technologies. By merging its sensor and RF businesses into a new division, Infineon now integrates various sensing technologies, including high SNR silicon microphones, ToF sensors, and radar, providing enhanced environmental perception for edge devices. Liu Wei said: “By integrating our sensor business, we can better combine our sensor products with others to deliver improved solutions for customers.” For example, in IoT scenarios, sensors paired with low-power MCUs support on-device data collection and AI inference, reducing reliance on the cloud and lowering latency and bandwidth costs.
According to observations by Chip Insights, Infineon’s AI strategy is characterized by several key traits:
First, full-chain coverage—from the power grid to motherboard cores, and from data centers to edge devices.
Second, technological diversity—flexibly leveraging MCUs, sensors, and power devices.
Third, material variety—using silicon, SiC, and GaN to meet diverse needs.
Finally, a strong focus on energy efficiency—always prioritizing energy conversion performance.
This approach gives Infineon a unique edge in the increasingly competitive AI race. “AI ultimately comes down to computing power, and computing power ultimately comes down to electricity.” From the start, Infineon has used its strengths to build technological barriers at key points in AI infrastructure.
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Right Hand: Robotics – From Core Components to System Solutions
If AI represents Infineon’s strategy in digital intelligence, then robotics reflects its ambitions in embodied intelligence. As companies like Tesla and Unitree Robotics accelerate humanoid robot development, Infineon is advancing the field with its comprehensive semiconductor solutions.
✅ Solving Robotics’ “Motion Pain Points”
The core of robotic motion systems lies in joint actuation—an area where Infineon’s technology excels. David Poon shared a typical case: “Some robotics companies focus on software and algorithms to enable complex movements and learning capabilities but don’t delve deeply into motor drive design. Instead, they prefer to integrate standardized components from third-party suppliers. Infineon works closely with industry partners to optimize motor drive design and accelerate product development.”
Infineon applies its third-generation GaN semiconductor materials to motor drives. Compared to traditional silicon-based devices, GaN devices operate at higher frequencies, enabling more compact systems with higher efficiency. Poon said: “If a robot’s 30–50 joints can be reduced in size, overall weight drops significantly, and battery life extends. This is hugely beneficial for the robotics industry.”
✅ Full-Stack Capabilities From Head to Toe: Comprehensive Technical Support for Intelligent Robots
Beyond motor drives, Infineon provides complete solutions covering perception, embedded control, human-machine interaction, and real-time decision-making. These include:
- Sensing: Radar, ToF, and other environmental sensing technologies
- Control: AURIX, TRAVEO microcontroller series
- Connectivity: Wi-Fi, Bluetooth, and other wireless technologies
- Security: OPTIGA™ series security chips
- Power: High-efficiency power solutions
These full-stack capabilities enable Infineon to offer one-stop solutions for robotics companies, significantly shortening development cycles. Liu Wei stated: “We collaborate with many domestic robotics companies, offering integrated solutions for motor drives, joint control, environmental perception, HMI, and real-time decision-making. By combining GaN devices with microcontrollers, we help customers design more compact and efficient products.”
Poon emphasized: “Infineon’s solutions not only enhance the performance of key robot components but also provide solid technical support for the industry’s intelligent development.”
Infineon’s robotics strategy reflects a deep understanding of industry challenges. Lu Hanchen, Director of GG Robotics Industry Research Institute, noted in his speech: “From ‘usable’ to ‘user-friendly,’ there’s still much room for hardware improvement. Chips and mechanical components like ball screws are major bottlenecks.”
Infineon addresses these issues with targeted solutions and places special emphasis on collaboration with Chinese robotics companies. As China’s robotics industry rapidly expands, partnerships with local innovators like Digua Robotics help Infineon better understand domestic market needs and quickly translate technology into real-world applications. These practical experiences feed back into product design, forming a positive optimization loop. This strategy of deep localization positions Infineon favorably in the world’s largest robotics market.
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In Conclusion
From Infineon’s full conference presentations, a clear image emerges: a steady innovator actively embracing cutting-edge markets like AI and robotics, while maintaining a strong focus on its core strengths in power devices, MCUs, and sensors. Leveraging years of technical expertise, the company is turning emerging trends into innovation advantages.
This differentiated innovation strategy allows Infineon to stay ahead technologically while maintaining strong progress in commercialization and financial health. In an industry full of uncertainties, Infineon uses technological innovation as its spear and real-world application demand as its shield—writing a new chapter in its story. With AI in the left hand and robotics in the right, this semiconductor giant’s journey is just beginning.
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