Author Archives: Leo
IC Quality Control Explained: CP, FT and WAT Testing
Explore CP, FT, and WAT testing as the core trio of quality control in integrated [...]
Jun
Top Software Tools Used in Chip Front End Design
Discover essential software tools used in front end chip design, boosting efficiency, accuracy, and productivity [...]
Jun
RTX 5070 Ti Mobile or 5060 Ti Desktop? Game Showdown
Discover which GPU dominates in gaming—RTX 5070 Ti mobile or RTX 5060 Ti desktop—in this [...]
Jun
NAND Controller Prices Rise on BT Substrate Shortage
BT substrate delays from MGC strain NAND and AI supply chains, driving costs up and [...]
May
USB 2 vs USB 3 PCB Layout and Routing Best Practices
Master PCB layout and routing for USB 2.0 and 3.0 to boost signal quality, performance, [...]
May
Master USB Interface PCB Design with Pro Techniques
Complete guide to USB PCB design—covering Type C, signal integrity, and high-speed layout essentials for [...]
May
CPU vs SoC vs MCU: Understand the Core Differences
Learn the core differences between CPU, SoC, and MCU to select the right solution based [...]
May
Dry Etching Technology: Principles, Features and Uses
Explore dry etching technology in depth—covering its core principles, key features, and practical applications across [...]
May
WiFi 6 MU-MIMO Explained: Speed, Power, and More
Explore how MU-MIMO technology enhances WiFi 6 speed, efficiency, and performance, unlocking a new era [...]
May
Fixed BIOS Freeze in 5 Hours with Self-Taught Method
Solved BIOS stuck problem in 5 hours through self-learning—easy, fast and effective method anyone can [...]
May
How to Add XP Shared Printer to Windows 7 Network?
Step-by-step guide to add a shared XP network printer to Windows 7 quickly and easily [...]
May
New 321-Layer UFS 4.1 Flash by SK Hynix in 2026
SK Hynix unveils 321-layer UFS 4.1 flash with 7% better efficiency, aiming for mass production [...]
May
Master ALD Thin Film Deposition in One Quick Guide
Explore atomic layer deposition (ALD) thin film technology in one article—process, benefits, and key insights [...]
May
Understanding Soldering Defects in Solder Paste Process
Explore the causes and solutions for cold soldering in the solder paste process to enhance [...]
May
Everything You Need to Know About Silicon CPO Technology
Discover the basics of Silicon Photonic Chip Co-Packaging (CPO) technology, its benefits, and applications in [...]
May
June–July 2025 Sparks New Hike in Chip Market Prices
Storage chip prices are set to rise sharply from June to July 2025, sparking a [...]
May
WPS on Routers: What It Is and How It Works Explained
Discover what WPS on your router means, how it works, and why it’s important for [...]
May
Wafer Prices Set to Rise 10 Percent by TSMC June 2025
TSMC aims to raise wafer prices by 10% in June 2025, affecting chipmakers and hinting [...]
May
Essential Excel Functions for FAB Engineers to Master
Learn 7 essential Excel functions to double your efficiency as a FAB engineer and streamline [...]
May
Why Cu Replaced Al in Semiconductor Interconnects?
Copper replaced aluminum in chips due to lower resistance, better reliability, and improved performance in [...]
May