Author Archives: Leo
New 321-Layer UFS 4.1 Flash by SK Hynix in 2026
SK Hynix unveils 321-layer UFS 4.1 flash with 7% better efficiency, aiming for mass production [...]
May
Master ALD Thin Film Deposition in One Quick Guide
Explore atomic layer deposition (ALD) thin film technology in one article—process, benefits, and key insights [...]
May
Understanding Soldering Defects in Solder Paste Process
Explore the causes and solutions for cold soldering in the solder paste process to enhance [...]
May
Everything You Need to Know About Silicon CPO Technology
Discover the basics of Silicon Photonic Chip Co-Packaging (CPO) technology, its benefits, and applications in [...]
May
June–July 2025 Sparks New Hike in Chip Market Prices
Storage chip prices are set to rise sharply from June to July 2025, sparking a [...]
May
WPS on Routers: What It Is and How It Works Explained
Discover what WPS on your router means, how it works, and why it’s important for [...]
May
Wafer Prices Set to Rise 10 Percent by TSMC June 2025
TSMC aims to raise wafer prices by 10% in June 2025, affecting chipmakers and hinting [...]
May
Essential Excel Functions for FAB Engineers to Master
Learn 7 essential Excel functions to double your efficiency as a FAB engineer and streamline [...]
May
Why Cu Replaced Al in Semiconductor Interconnects?
Copper replaced aluminum in chips due to lower resistance, better reliability, and improved performance in [...]
May
How to Become an Outstanding Chip Product Manager?
Learn how to excel as a chip product manager with expert insights, essential skills, and [...]
May
HKMG Technology: Key to Sub-28nm Advanced Node Success
HKMG technology is crucial for the successful manufacturing of advanced semiconductor processes under 28nm, boosting [...]
May
2nm Process Nodes Reveal Critical Chip Yield Issues
Chip tapeout success rates drop to 14%, while 2nm yield challenges grow—AI, complexity, and speed [...]
May
How NAND Flash Works: Data Storage & Electron Trapping
Learn how NAND flash stores data, the differences with NOR, and how wear leveling and [...]
May
Importance of Lot Owners in FAB Business Models
Discover why lot owners are vital in FAB operations, driving success and shaping the future [...]
May
SAW vs BAW: Key Differences Between Acoustic Waves
Explore the difference between SAW and BAW acoustic wave technologies, their benefits, and how each [...]
May
Energy Drain in Chip Production: What You Should Know
Discover why chip manufacturing uses so much energy and what makes the process so power-hungry [...]
May
What Is Polysilicon Depletion Effect in Semiconductor Chips?
Learn how the polysilicon depletion effect impacts semiconductor chip performance, gate control, and advanced transistor [...]
May
RTX 5070 Ti vs RTX 5080: 4K Gaming Performance Test
See how the RTX 5070 Ti stacks up against the RTX 5080 in 4K gaming. [...]
May
Arm: What’s Happening in the AI Chip Industry?
Explore how Arm is transforming the AI chip industry and shaping future advancements in technology [...]
May
3D DRAM Technology Primed for Major Growth in 2025
3D DRAM will reshape memory tech in 2025, driving speed, power efficiency, and next-gen computing [...]
May