Author Archives: Leo
Discover 3 TGV Hole Shapes & Their Unique Applications
Learn 3 main TGV hole types—hourglass, tapered, straight—with their benefits, challenges, and ideal applications in [...]
Jul
Bluetooth Protocols: 1.0 to 6.0 Key Innovations
Explore Bluetooth evolution from 1.0 to 6.0, highlighting key innovations, faster speeds, and the future [...]
Jul
Memory Cell Wear: NAND Cycles vs DRAM Aging
Learn how NAND and DRAM store data, what causes wear, and how each memory type's [...]
Jul
Difference Between Active and Passive Devices in Chips
Understand the core differences between active and passive devices in chips, including functions, energy control, [...]
Jun
Why Elevators Kill Your Signal—The Surprising Science
Learn why elevator rides kill your phone signal and how new tech is fighting back [...]
Jun
Key Challenges That Make TSV Electroplating Complex
TSV via filling is complex due to voids, current crowding, and poor electrolyte flow—additives help [...]
Jun
SoC Alternatives: Chip Design and Integration Explained
Explore how chip design and heterogeneous integration offer cost-effective, scalable alternatives to SoCs for high-performance [...]
Jun
What Is EDA Software and Why It’s Crucial to Design
EDA software enables electronic design automation, streamlining circuit design, analysis, and testing—critical for innovation in [...]
Jun
How Die Attach Ensures Chip Stability and Performance
Explore the die attach process, its purpose, materials, accuracy demands, and inspection methods critical to [...]
Jun
Explore Logic Chips: Types and Key Differences with Analog
Discover the definition, types of logic chips, and how they differ from analog chips in [...]
Jun
Epoxy Molding Compound: Core IC Protection Material
Learn the IC molding process, materials, risks, and why it’s essential for chip protection, electrical [...]
Jun
RTX 5060 vs 4060: Game Test Results Revealed
Discover how the GeForce RTX 5060 stacks up against the 4060 with real gaming benchmarks [...]
Jun
How Far Can ASML EUV Lithography Technology Go?
Explore how far ASML EUV lithography can evolve, its breakthroughs, current limits, and what’s next [...]
Jun
DDR4 Supply Cuts Trigger DRAM Price Surge Worldwide
Global DDR4 supply dwindles as major makers shift to DDR5. Prices soar while industries struggle [...]
Jun
Top EDA Tools Commonly Used in Chip Design Work
Explore the most widely used EDA tools in chip design, supporting IC development, verification, and [...]
Jun
TSMC 2025 Tech Forum Reveals Key Innovations Recap
Discover key announcements, innovations, and roadmap updates from the 2025 TSMC Technology Forum in this [...]
Jun
Metal ECP: How Much Edge Cleaning is Needed?
Learn why edge cleaning is crucial in Metal ECP and how much width is typically [...]
Jun
How ASML Builds Its Billion-Dollar Lithography Machines?
Explore how ASML creates billion-dollar lithography systems driving next-gen chipmaking with unmatched precision and global [...]
Jun
Lithography Area: Why It’s Known as Yellow Light
Explore why lithography zones are called yellow light areas and the crucial role they play [...]
Jun
What Is Chip Backend Design? Explained Simply
Explore chip backend design from DFT to GDSII, covering steps, tools, and real-world analogies for [...]
Jun