Author Archives: Leo
Why Elevators Kill Your Signal—The Surprising Science
Learn why elevator rides kill your phone signal and how new tech is fighting back [...]
Jun
Key Challenges That Make TSV Electroplating Complex
TSV via filling is complex due to voids, current crowding, and poor electrolyte flow—additives help [...]
Jun
SoC Alternatives: Chip Design and Integration Explained
Explore how chip design and heterogeneous integration offer cost-effective, scalable alternatives to SoCs for high-performance [...]
Jun
What Is EDA Software and Why It’s Crucial to Design
EDA software enables electronic design automation, streamlining circuit design, analysis, and testing—critical for innovation in [...]
Jun
How Die Attach Ensures Chip Stability and Performance
Explore the die attach process, its purpose, materials, accuracy demands, and inspection methods critical to [...]
Jun
Explore Logic Chips: Types and Key Differences with Analog
Discover the definition, types of logic chips, and how they differ from analog chips in [...]
Jun
Epoxy Molding Compound: Core IC Protection Material
Learn the IC molding process, materials, risks, and why it’s essential for chip protection, electrical [...]
Jun
RTX 5060 vs 4060: Game Test Results Revealed
Discover how the GeForce RTX 5060 stacks up against the 4060 with real gaming benchmarks [...]
Jun
How Far Can ASML EUV Lithography Technology Go?
Explore how far ASML EUV lithography can evolve, its breakthroughs, current limits, and what’s next [...]
Jun
DDR4 Supply Cuts Trigger DRAM Price Surge Worldwide
Global DDR4 supply dwindles as major makers shift to DDR5. Prices soar while industries struggle [...]
Jun
Top EDA Tools Commonly Used in Chip Design Work
Explore the most widely used EDA tools in chip design, supporting IC development, verification, and [...]
Jun
TSMC 2025 Tech Forum Reveals Key Innovations Recap
Discover key announcements, innovations, and roadmap updates from the 2025 TSMC Technology Forum in this [...]
Jun
Metal ECP: How Much Edge Cleaning is Needed?
Learn why edge cleaning is crucial in Metal ECP and how much width is typically [...]
Jun
How ASML Builds Its Billion-Dollar Lithography Machines?
Explore how ASML creates billion-dollar lithography systems driving next-gen chipmaking with unmatched precision and global [...]
Jun
Lithography Area: Why It’s Known as Yellow Light
Explore why lithography zones are called yellow light areas and the crucial role they play [...]
Jun
What Is Chip Backend Design? Explained Simply
Explore chip backend design from DFT to GDSII, covering steps, tools, and real-world analogies for [...]
Jun
Ryzen 7 5700X3D vs 9600X: Game Test Showdown
Gaming test reveals if Ryzen 5700X3D or 9600X is the smarter upgrade. Compare FPS, value, [...]
Jun
Nintendo Switch 2 Teardown Reveals Key Suppliers by iFixit
Switch 2 teardown reveals core chip suppliers, offering new insights into Nintendo’s next-gen console tech [...]
Jun
RTX 5060 Ti with i5 12400F: Gaming Bottleneck Check
Explore gaming benchmarks to see if the i5 12400F causes a bottleneck when paired with [...]
Jun
Here’s Why Wafer Carriers Always Hold 25 Wafers Only
Learn why wafer boxes are limited to 25 wafers—ensuring safety, precision handling, and contamination control [...]
Jun