According to news yesterday, investment firm GF Securities stated in a report that the A20 chip in the iPhone 18 series will be manufactured using TSMC’s third-generation 3nm process, N3P. However, analyst Jeff Pu refuted this, claiming that the A20 chip is built on TSMC’s 2nm process, and the news about Apple using 3nm can be disregarded.
It is reported that TSMC has already started trial production of its 2nm process at its Baoshan plant in Hsinchu, with an initial yield rate of 60%. Mass production is expected to begin in the second half of 2025.
Previously, Morgan Stanley released a report stating that TSMC’s monthly 2nm production capacity in 2025 will increase from this year’s 10,000 trial wafers to about 50,000 mass production wafers. Due to the time required for capacity ramp-up and yield improvement, the A19 processor series in Apple’s 2025 iPhone 17 series may not adopt the 2nm process and will instead upgrade to the N3P process within the 3nm family.
According to TSMC’s disclosed data, the 2nm process can reduce power consumption by 24%–35% or increase performance by 15% under the same voltage, with transistor density 1.15 times higher than the previous 3nm generation. These improvements are mainly attributed to TSMC’s new Gate-All-Around (GAA) nanosheet transistors and the collaborative optimization of the N2 NanoFlex design technology along with other enhancements.
In terms of pricing, sources indicate that TSMC’s 2nm wafers are priced over $30,000, while 3nm wafers currently cost around $18,500 to $20,000, showing a significant price gap. Industry insiders expect that due to the high pricing of advanced nodes, manufacturers will inevitably pass the cost pressure on to downstream clients or end consumers.
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