On July 30th, SK Hynix announced the launch of its highest-performance next-generation graphics memory product, GDDR7.
SK Hynix stated, “GDDR7 features dedicated graphics processing capabilities and high-speed characteristics, with increasing attention from global artificial intelligence application customers. Responding to this trend, the company completed development of the latest GDDR7 specifications in March this year, and is now officially launching it with mass production scheduled to begin in the third quarter of this year.”
SK Hynix’s GDDR7 achieves speeds up to 32Gbps (32 gigabits per second), over 60% faster than the previous generation, with peak speeds reaching 40Gbps depending on usage scenarios. Integrated into the latest graphics cards, the product supports data processing of over 1.5TB per second, equivalent to handling 300 Full-HD movies (5GB) in one second.
In addition, GDDR7 improves energy efficiency by over 50% compared to the previous generation. To address heat dissipation challenges from ultra-high-speed data processing, SK Hynix utilized advanced packaging technologies in the product’s development process.
The company’s technical team maintained product dimensions while increasing the heat dissipation substrate layers in the packaging from four to six, and employed high thermal conductivity epoxy molding compounds (EMC) in the packaging materials. As a result, the team successfully reduced thermal resistance of the product by 74% compared to the previous generation.
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