The semiconductor industry has surpassed traditional steel and automobile industries to become a high-value, high-tech industry of the 21st century. Semiconductors are the core of many industrial equipment, widely used in core areas such as computers, consumer electronics, network communications, and automotive electronics.
Semiconductors mainly consist of four components: integrated circuits, optoelectronic devices, discrete devices, and sensors. Integrated circuits, which account for over 80% of the semiconductor industry, include logic chips, memory chips, analog chips, and MPUs. The rapid development of integrated circuits in terms of performance, integration, and speed is based on the advancement of semiconductor physics, semiconductor devices, and semiconductor manufacturing processes.
The semiconductor industry is so vast that semiconductor process equipment provides the manufacturing foundation for large-scale semiconductor production. In the future, semiconductor devices will be more integrated, miniaturized, and powerful. Below are the main devices used in the semiconductor production process.
Single Crystal Furnace
Equipment Function: Melting semiconductor materials, pulling single crystals, and providing semiconductor ingots in the form of single crystals for the subsequent manufacturing of semiconductor devices.
Major Enterprises (Brands):
International: PVA TePla AG (Germany), Ferrotec Corporation (Japan), QUANTUM DESIGN (USA), Gero (Germany), KAYEX Corporation (USA).
Domestic: Beijing Jingyuntong (China), Qixing Huachuang (China), Beijing Jingyi Century (China), Hebei Jinglong Sunshine (China), Xi’an University of Technology Jingke (China), Changzhou Huasheng Tianlong (China), Shanghai Hanhong (China), Xi’an Huade (China), China Electronics Technology Group Corporation No. 48 Research Institute (China), Shanghai Shenhe Thermomagnetic (China).
Metal Organic Chemical Vapor Deposition (MOCVD) Reactor
Equipment Function: The MOCVD reactor provides a specific process environment for the growth of epitaxial thin-film crystals with a corresponding relationship to the single crystal on which they are grown. This process prepares the foundation for functional epitaxial growth on a single crystal substrate. MOCVD is a special technique of chemical vapor deposition, where the crystal structure of the grown thin film continues the epitaxial relationship with the substrate, maintaining a corresponding crystallographic orientation.
Major Enterprises (Brands):
International: CVD Equipment Corporation (USA), GT Advanced Technologies (USA), Soitec (France), AS (France), Proto Flex Corporation (USA), Kurt J. Lesker Company (USA), Applied Materials (USA).
Domestic: China Electronics Technology Group Corporation No. 48 Research Institute (China), Qingdao Saiterda (China), Hefei Kejing Materials Technology Co., Ltd. (China), Beijing Jinsheng Micronano (China), Jinan Liguan Electronic Technology Co., Ltd. (China).
Molecular Beam Epitaxy (MBE) System
Equipment Function: The Molecular Beam Epitaxy (MBE) system provides a specialized apparatus for growing thin films on substrate surfaces. MBE is a technique used to create single-crystal thin films, where the films are grown layer by layer along the crystal axes of an appropriate substrate under suitable conditions.
Major Enterprises (Brands):
International: Riber (France), Veeco Corporation (USA), DCA Instruments (Finland), SVT Associates (USA), NBM Corporation (USA), Omicron NanoTechnology (Germany), MBE-Komponenten GmbH (Germany), Oxford Applied Research (OAR) Ltd. (United Kingdom).
Domestic: Shenyang Zhongke Instrument Co., Ltd. (China), Beijing Huidexin Technology Co., Ltd. (China), Shaoxing Kuangtai Instrument Equipment Co., Ltd. (China), Shenyang Keyou Vacuum Technology Co., Ltd. (China).
VDF Oxidation Furnace
Equipment Function: The VDF Oxidation Furnace is used for the oxidation treatment of semiconductor materials, providing the required oxidizing atmosphere to achieve the anticipated semiconductor oxidation process. It is an essential component in the semiconductor manufacturing process.
Major Enterprises (Brands):
International: Thermco (United Kingdom), Centrotherm Thermal Solutions GmbH & Co. KG (Germany).
Domestic: Beijing Qixing Huachuang (China), Qingdao Furunde (China), China Electronics Technology Group Corporation No. 48 Research Institute (China), Qingdao Xuguang Instrument Equipment Co., Ltd. (China), China Electronics Technology Group Corporation No. 45 Research Institute (China).
Low-Pressure Chemical Vapor Deposition System (LPCVD)
Equipment Function: The LPCVD system introduces vaporized gaseous or liquid reactants containing thin-film elements and other required gases into the reaction chamber of the LPCVD equipment. Chemical reactions take place on the substrate surface to produce thin films.
Major Enterprises (Brands):
International: Hitachi International Electric Company (Japan)
Domestic: Shanghai Chi-Jian Semiconductor Technology Co., Ltd. (China), China Electronics Technology Group Corporation No. 48 Research Institute (China), China Electronics Technology Group Corporation No. 45 Research Institute (China), Beijing Instrument Factory (China), Shanghai Machinery Factory (China).
Plasma-Enhanced Chemical Vapor Deposition System (PECVD)
Equipment Function: In the deposition chamber, the PECVD system utilizes glow discharge to ionize the gas, which then undergoes a chemical reaction on the substrate surface to deposit semiconductor thin-film materials.
Major Enterprises (Brands):
International: Proto Flex Corporation (USA), Tokki Corporation (Japan), Shimadzu Corporation (Japan), Lam Research Corporation (USA), ASM International (Netherlands).
Domestic: China Electronics Technology Group Corporation No. 45 Research Institute (China), Beijing Instrument Factory (China), Shanghai Machinery Factory (China).
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