On January 28th, according to the latest report published by the market research firm Market.us, the global chiplet architecture market size was $3.1 billion in 2023 and is expected to skyrocket to $107 billion by 2033, an increase of 3352%. The compound annual growth rate from 2024 to 2033 is projected to be 42.5%.
The report points out that chiplet architecture is a heterogeneous integration technology. Using chiplet design technology, it can integrate multiple heterogeneous chiplets with different functions into a single chip package using advanced packaging technology, effectively addressing the limitations of Moore’s Law. The growing demand for high-performance computing in various industries, including artificial intelligence, data centers, automotive, and consumer electronics, is a key factor driving the rapid development of the chiplet market. Since chiplet architecture can efficiently process complex computations while reducing energy consumption, it is particularly suitable for advanced computing tasks.
Currently, two major processor manufacturers, Intel and AMD, are actively developing products based on chiplet architecture. For instance, Intel’s Intel Core Ultra consumer processor, codenamed Meteor Lake and officially announced in September 2023, includes chiplets of CPU, GPU, SoC, and I/O, produced using different process technologies. These chiplets are connected and packaged within a single chip using Intel’s Foveros 3D advanced packaging technology. This approach enables Intel to move beyond single-chip architecture, allowing more flexible chiplet designs and optimization for specific functions, aiming to save costs and improve computational performance.
As for AMD, it adopted the chiplet architecture even earlier than Intel. Its Ryzen9 5900X processor, launched in 2020 and manufactured using TSMC’s 7nm process, already employed chiplet architecture and confirmed its performance. AMD pointed out that compared to traditional chip design methods, chiplet architecture offers advantages like faster upgrade cycles, lower costs, and higher yields. With the rise of chiplet architecture technology, chip design could further simplify into a method akin to stacking IP cores, potentially restructuring the semiconductor manufacturing ecosystem.
The report also notes that the chiplet market is expected to grow significantly, driven by various factors, and bring numerous developments in areas such as artificial intelligence, 5G, and the Internet of Things (IoT). Additionally, the growing need for standardization and interoperability among different chipsets provides unique collaborative opportunities for the semiconductor industry. Such collaboration can promote the development of a strong ecosystem, accelerate innovation, and expand the application range of chiplets. Therefore, this trend led to the formation of the UCIe Alliance in 2022 by companies including Intel, AMD, Microsoft, Meta, Google, Qualcomm, Samsung, and TSMC, to provide standards for the interconnectivity of chiplet architectures.
Currently, among the top 5 IC design companies globally, AMD, Qualcomm, NVIDIA, MediaTek, and Intel are successively investing in the development and design of chiplet architectures. Additionally, Intel showcased the world’s first chiplet architecture processor connected via the UCIe standard in 2023. This processor combines cutting-edge technologies from TSMC and Intel, with two chipsets using Intel’s 3 processes and TSMC’s N3E process, as well as Synopsys UCIe IP, connected through Intel’s EMIB advanced packaging. Therefore, with various manufacturers focusing on the development of chiplet architecture, the prospects of the chiplet market are very promising.
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