Top Electronic Product Reliability Tests You Must Know

01

Methods of Reliability Testing for Electronic Products

I. Methods Related to Basic Test Procedures

Before conducting a reliability test, it’s essential to determine the test objectives, which serve as the starting point. For example, to test the reliability of a smartphone, objectives may include determining its lifespan under normal usage conditions, functional stability, and adaptability to different environments. Clarifying these objectives helps define the test content, scope, and duration. Next, design the test plan based on the objectives. The plan should cover testing methods (e.g., type of reliability test), procedures (sequence and operation of each test step), environment (temperature, humidity, electromagnetic conditions), and parameters (voltage, current, etc.). A well-designed test plan ensures the reliability and validity of the test results.

Defining test metrics is also crucial, including reliability parameters (such as Mean Time Between Failures—MTBF), evaluation criteria (e.g., pass/fail limits), and test thresholds (e.g., acceptable performance levels). Clearly defined metrics make test goals feasible and measurable. Finally, build a test environment that simulates actual usage scenarios—for example, testing smartphones under temperature variations (-10°C to 40°C) and electromagnetic interference levels typical of everyday environments.

II. Common Test Types and Methods

Reliability Testing
Environmental Testing – Assesses how well electronic products adapt to various environments.

Temperature-related Tests:

• High Temperature Test: Based on standards like GB/T2423.2, test products at elevated temperatures (e.g., 40°C, 60°C) for a set time to observe performance. Issues such as parameter drift or component failure may occur.
• Low Temperature Test: Based on GB/T2423.1, test at temperatures like -20°C or -40°C to evaluate cold resistance. Problems may include battery degradation or LCD lag.
• Temperature and Humidity Cycling Test: Referencing GB/T2423.34, simulate climate transitions and transportation conditions. Moisture absorption may affect electrical performance, while thermal expansion mismatch could lead to mechanical stress or solder joint failures.

Mechanical Environmental Tests:

• Mechanical Shock Test: Determines whether products withstand sudden impacts from handling, transport, or accidental drops. Applies specified acceleration and pulse durations, then checks for structural damage or functional anomalies.
• Variable Frequency Vibration Test: Evaluates component resonance risks across frequency ranges. Resonance can cause solder cracks, loose wires, or screw failures. Essential for devices used in high-vibration environments like aircraft.

Electromagnetic Compatibility Tests:

• Radiation Test: Places devices in specific electromagnetic fields to evaluate their resistance to interference.
• Immunity Test: Tests whether products can function normally under electromagnetic interference (e.g., in industrial settings). Based on standards like IEC.

Life Testing

• Non-operational Storage Life Test: Assesses how long products or components remain stable in storage. Focus on battery discharge, leakage, or capacity loss.
• Operational Life Test: Products run continuously in normal conditions until failure (e.g., TV playing until screen glitches or freezes). Often uses accelerated life testing with higher temperature/voltage to expose long-term failures early.

Tests by Purpose

• Screening Test: Filters defective products during production via stress tests like high temp or voltage.
• Qualification Test: Verifies new designs meet required standards, such as for aerospace applications.
• Acceptance Test: Conducted by buyers or third parties before product delivery to ensure compliance with contract terms.

Tests by Nature

• Destructive Test: Breaks samples to determine limits, such as tensile strength.
• Non-destructive Test: Most reliability tests fall into this category (e.g., EMC tests, appearance checks, functional testing).

Test Cycle Methods

• Test – Record Issues – Retest: Problems are logged during trials and resolved collectively later. Suitable for multiple fault types with one dominant issue.
• Test – Improve – Retest: Address a critical and common issue immediately, then retest (e.g., all devices fail due to poor heat dissipation).
• Deferred Improvement Test – Improve – Retest: Combines both methods. Simple issues are fixed immediately; complex ones are delayed until after testing.

III. Other Supporting Methods

Data Analysis During Monitoring
During accelerated aging tests (e.g., high temp and humidity with current stress), track parameters like current, voltage, deformation, etc. Plot curves to detect aging trends, predict failure, and adjust conditions accordingly.

Failure Mode-Based Testing
Design stress tests based on likely failure mechanisms (e.g., short circuits under humidity). Apply targeted stress while monitoring performance to uncover hidden reliability risks.

02

Common Reliability Testing Standards for Electronic Products

I. General Standard Requirements

Environmental Adaptability Standards

• High Temperature: GB/T2423.2, IEC60068-2-2
• Low Temperature: GB/T2423.1, IEC60068-2-1
• Humidity: GB/T2423.3, IEC60068-2-78
• Low Pressure: Simulates high-altitude environments for avionics, etc.

Mechanical Strength Standards

• Shock: GB/T2423.5, IEC60068-2-27
• Vibration: GB/T2423.56, IEC60068-2-64

Electromagnetic Compatibility Standards

• Radiation: ISO4892.2, GB/T16422.2
• Immunity: IEC series, e.g., for electrostatic discharge or RF interference

Reliability Life Standards

• Accelerated life tests estimate actual lifespan using models and stress conditions. No universal standard due to varied product types but MTBF is commonly used.

II. Standards for Detection Procedures

1. Application Process Standards

• Submit product info, test requirements, and sample quantity. Coordinate test schedule, location, and method. Ensure proper sample packaging and labeling. Final reports are issued after testing.

2. Execution Standards by Project

• Temperature Change: GB/T2423.22, IEC60068-2-14
• Humidity Cycling: GB/T2423.4, IEC60068-2-30
• Mechanical Shock: GB/T2423.5, IEC60068-2-27
• Vibration: GB/T2423.56, IEC60068-2-64
• Radiation: ISO4892.2, GB/T16422.2

03

Factors Affecting Reliability Test Results of Electronic Products

I. Environmental Factors

• Temperature: Affects semiconductor properties, battery performance, LCD responsiveness, etc.
• Humidity: Leads to corrosion, short circuits, and static discharge.
• Air Pressure: Affects heat dissipation and seal integrity.
• Pollutants: Dust and particles may cause short circuits or corrosion.
• Salt Spray: Corrosive effect in coastal/marine environments.

Electromagnetic Environment:

• Interference Sources: Natural (lightning, sunspots) and human-made (motors, microwaves, wireless devices).
• Shielding Effectiveness: Poor shielding can lead to inaccurate EMC test results.

II. Mechanical Structural Factors

• Mechanical Design: Affects stress distribution, heat dissipation, and maintenance.
• Vibration/Impact: Can loosen components or cause hidden micro-damage.

III. Manufacturing Process Factors

• Assembly Quality: Improper soldering or loose connections can distort test results.
• Material Quality: Low-grade components may fail early.
• Production Environment: Dust, humidity, or temperature irregularities affect assembly precision and product performance.

04

Reliability Test Case Studies

I. Smartphone Case

• Tests: Temperature, impact (1–1.2m drop), vibration (10–50Hz, 1–2G), EMC (radiation and immunity)
• Issues: Overheating (due to poor heat dissipation design), camera failure after drops (weak mounting), Bluetooth instability (poor EMC isolation)
• Improvements: Better heat materials and contact area, shock-absorbing camera mount, reworked antenna layout with shielding

II. Automotive Control System Case

• Tests: Temperature/humidity cycling (-40°C to 80°C, 30%–95%), vibration (10–200Hz, 0.5–5G), EMC
• Issues: Sensor accuracy drop (poor sealing), connector loosening, control unit misbehavior under EMI
• Improvements: Enhanced sealing, redesigned connectors with spring clips, upgraded ESD and filtering circuits

05

Latest Reliability Testing Technologies for Electronic Products

I. MEMS Reliability Testing

Challenges:
MEMS devices are tiny and sensitive; conventional equipment can’t detect micro deformations, high-frequency responses, or sub-micron parameters.

New Techniques:

• High-Precision Micro-Displacement Measurement: Laser interferometry detects sub-micron movement without contact.
• High-Resolution Electrical Parameter Testing: Atomic Force Microscopy (AFM) combined with electrical probing enables precise capacitance/resistance testing.
• High-Frequency Testing: Vector Network Analyzers (VNAs) assess MEMS behavior across MHz–GHz for RF reliability evaluation.

II. AI-Assisted Reliability Testing

Advantages:
AI can efficiently analyze large test datasets (e.g., electrical data, temperature, failure logs). Algorithms detect patterns, predict failures, and optimize test conditions for better reliability assessment.

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