How Many Layers Are in UV Tape Used for Wafer Dicing?

A friend asked again, could you please explain the function and structure of dicing UV tape?

01

What is wafer dicing UV tape?

UV tape has high adhesion and is mainly used to secure the wafer during the dicing process to prevent it from moving. It also holds the individual chips on the tape after dicing, preventing them from being washed away by the cutting fluid. After dicing is complete, the tape is exposed to UV light. Upon UV exposure, the tape’s adhesion significantly decreases, making it easy to remove the diced chips from the tape.

02

What is the principle behind UV tape losing its adhesion?

There are several principles. One of them is: UV glue contains unsaturated bonds, and these groups absorb energy under UV exposure, becoming excited to a high-energy state. This excited state causes molecular chains to break, weakening the intermolecular forces and reducing the adhesive strength of the tape.

03

Structure of UV tape

It mainly consists of three layers: PET backing layer, UV adhesive layer, and release liner layer.

• PET Backing: The PET backing has excellent physical strength and high-temperature resistance.
• UV Release Adhesive: This is the adhesive layer of the tape, which loses adhesion after UV light exposure.
• Release Liner: It protects the UV adhesive layer before use, preventing contamination. The release liner is peeled off during use to expose the UV adhesive layer, allowing it to adhere to the wafer.

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